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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10381243 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

Jul. 26, 2017

Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Tatsuya Karasawa, Shiojiri, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H05K 7/00 (2006.01); H05K 7/02 (2006.01); H01L 21/48 (2006.01); H01L 23/16 (2006.01); H01L 21/52 (2006.01); H01L 21/54 (2006.01); H01L 23/057 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 21/54 (2013.01); H01L 23/04 (2013.01); H01L 23/16 (2013.01); H01L 23/057 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor module in which no crack of a metal film exists in a terminal is provided. A semiconductor module is provided, including: a semiconductor element; a terminal with a metal film formed on a surface and including a bent portion; a resin case to which the terminal is fixed and in which a through hole is formed opposite to the terminal, the resin case housing a semiconductor element; a fastening portion provided inside the through hole; and a supporting portion provided inside the through hole and supporting the fastening portion.

Find Patent Forward Citations

Karasawa, Tatsuya. (2019). Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case (U.S. Patent No. 10381243). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10381243

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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