The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Sep. 25, 2013
Applicant:

Toshiba Memory Corporation, Minato-ku, Tokyo, JP;

Inventors:

Akio Ui, Tokyo, JP;

Hisataka Hayashi, Yokkaichi, JP;

Kazuhiro Tomioka, Yokohama, JP;

Hiroshi Yamamoto, Kuwana, JP;

Tsubasa Imamura, Kuwana, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01J 37/04 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32422 (2013.01); H01J 37/04 (2013.01); H01J 37/3211 (2013.01); H01J 37/3244 (2013.01); H01J 37/32091 (2013.01); H01J 37/32165 (2013.01); H01J 37/32568 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01J 37/32834 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/6831 (2013.01); H01L 21/68764 (2013.01); H01J 2237/3341 (2013.01);
Abstract

In one embodiment, a plasma processing apparatus includes: a chamber; an introducing part; a counter electrode; a high-frequency power source; and a plurality of low-frequency power sources. A substrate electrode is disposed in the chamber, a substrate is directly or indirectly placed on the substrate electrode, and the substrate electrode has a plurality of electrode element groups. The introducing part introduces process gas into the chamber. The high-frequency power source outputs a high-frequency voltage for ionizing the process gas to generate plasma. The plurality of low-frequency power sources apply a plurality of low-frequency voltages of 20 MHz or less with mutually different phases for introducing ions from the plasma, to each of the plurality of electrode element groups.


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