The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Aug. 07, 2017
Applicant:
Kemet Electronics Corporation, Simpsonville, SC (US);
Inventors:
John E. McConnell, Simpsonville, SC (US);
Garry L. Renner, Simpsonville, SC (US);
John Bultitude, Simpsonville, SC (US);
R. Allen Hill, Simpsonville, SC (US);
Galen W. Miller, Simpsonville, SC (US);
Assignee:
KEMET Electronics Corporation, Simpsonville, SC (US);
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/40 (2006.01); H01G 4/232 (2006.01); H01G 4/38 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H01G 4/002 (2006.01); B23K 35/36 (2006.01); B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B23K 20/22 (2006.01); B23K 35/02 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); B22F 3/10 (2006.01); H01G 4/008 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); B23K 20/002 (2013.01); B23K 20/026 (2013.01); B23K 20/16 (2013.01); B23K 20/22 (2013.01); B23K 35/0227 (2013.01); B23K 35/3613 (2013.01); H01G 4/002 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); B22F 3/1035 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01G 4/0085 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/1227 (2013.01); H01G 4/248 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/435 (2015.01);
Abstract
An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.