The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Oct. 31, 2017
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Te Connectivity Corporation, Berwyn, PA (US);
Shenzhen Ami Technology Co. Ltd., Shenzhen, CN;
Lei Zhou, Shanghai, CN;
Dandan Zhang, Shanghai, CN;
Roberto Francisco-Yi Lu, Shanghai, CN;
Qinglong Zeng, Shanghai, CN;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
TE Connectivity Corporation, Berywn, PA (US);
Shenzhen AMI Technology Co., Ltd., Shenzhen, CN;
Abstract
A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. The motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thus, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without debugging online, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.