The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Oct. 02, 2017
Applicant:

Impossible Objects, Inc., Northbrook, IL (US);

Inventors:

Robert Swartz, Highland Park, IL (US);

Buckley Crist, Wilmette, IL (US);

Eugene Gore, Des Plaines, IL (US);

Joseph M. Jacobson, Newton, MA (US);

Assignee:

Impossible Objects, Inc., Northbrook, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); B29C 64/153 (2017.01); B29C 64/141 (2017.01); G03G 15/22 (2006.01); B29C 70/22 (2006.01); B33Y 70/00 (2015.01); B32B 5/02 (2006.01); B32B 1/00 (2006.01); B32B 7/14 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B29C 64/141 (2017.08); B29C 64/153 (2017.08); B29C 70/22 (2013.01); B32B 1/00 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 7/14 (2013.01); B33Y 70/00 (2014.12); G03G 15/224 (2013.01); B29L 2009/00 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/04 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); G03G 15/225 (2013.01); Y10T 428/2481 (2015.01); Y10T 428/24479 (2015.01); Y10T 428/24826 (2015.01); Y10T 428/24843 (2015.01); Y10T 442/60 (2015.04); Y10T 442/67 (2015.04);
Abstract

A 3D object according to the invention involves substrate layers infiltrated by a hardened material. The 3D object may be fabricated by a method comprising the following steps: Flatten a substrate layer. Position powder on all or part of a substrate layer. Repeat this step for the remaining substrate layers. Stack the substrate layers. Transform the powder into a substance that flows and subsequently hardens into the hardened material. The hardened material solidifies in a spatial pattern that infiltrates positive regions in the substrate layers and does not infiltrate negative regions in the substrate layers. In a preferred embodiment, the substrate is carbon fiber and excess substrate is removed by abrasion. Flattening a substrate layer involves reducing planar inconsistencies or imperfections, and comprises applying heat to each substrate layer, cooling the substrate layers, and optionally applying tension and/or pressure to the heated and cooled substrate layers.


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