The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Mar. 30, 2015
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Yoshitake Kato, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 29/20 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/513 (2013.01); H01L 21/28264 (2013.01); H01L 29/2003 (2013.01); H01L 29/408 (2013.01); H01L 29/4236 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/7786 (2013.01); H01L 29/4238 (2013.01); H01L 29/66462 (2013.01); H01L 29/66522 (2013.01); H01L 29/7787 (2013.01);
Abstract

The characteristics of a semiconductor device are enhanced. In a semiconductor device (MISFET) having a gate electrode GE formed on a nitride semiconductor layer CH via a gate insulating film GI, the gate insulating film GI is configured to have a first gate insulating film (oxide film of a first metal) GIa formed on the nitride semiconductor layer CH and a second gate insulating film (oxide film of a second metal) GIb. And, the second metal (e.g., Hf) has lower electronegativity than the first metal (e.g., Al). By thus making the electronegativity of the second metal lower than the electronegativity of the first metal, a threshold voltage (Vth) can be shifted in a positive direction. Moreover, the gate electrode GE is configured to have a first gate electrode (nitride film of a third metal) GEa formed on the second gate insulating film GIb and a second gate electrode (fourth metal) GEb. This prevents the diffusion of oxygen to the gate insulating film GI, and variations in the threshold voltage (Vth) can be reduced.


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