The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jul. 31, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;

Inventors:

Dong-Hyun Im, Suwon-si, KR;

Daehyun Kim, Suwon-si, KR;

Hoon Park, Gyeonggi-Do, KR;

Jae-Hong Seo, Hwaseong-si, KR;

Chunhyung Chung, Seoul, KR;

Jae-Joong Choi, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 27/108 (2006.01); H01L 21/283 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10823 (2013.01); H01L 21/283 (2013.01); H01L 21/28079 (2013.01); H01L 27/10814 (2013.01); H01L 27/10876 (2013.01); H01L 29/4236 (2013.01); H01L 29/42376 (2013.01); H01L 29/4958 (2013.01); H01L 29/66621 (2013.01); H01L 21/28026 (2013.01); H01L 21/82345 (2013.01);
Abstract

A method of fabricating a semiconductor memory device includes etching a substrate that forms a trench that crosses active regions of the substrate, forming a gate insulating layer on bottom and side surfaces of the trench, forming a first gate electrode on the gate insulating layer that fills a lower portion of the trench, oxidizing a top surface of the first gate electrode where a preliminary barrier layer is formed, nitrifying the preliminary barrier layer where a barrier layer is formed, and forming a second gate electrode on the barrier layer that fills an upper portion of the trench.


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