The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Feb. 24, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Jeng-Nan Hung, Taichung, TW;
Chun-Hui Yu, Hsinchu County, TW;
Kuo-Chung Yee, Taoyuan County, TW;
Yi-Da Tsai, Chiayi Country, TW;
Wei-Hung Lin, Hsinchu County, TW;
Ming-Da Cheng, Hsinchu Country, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 21/566 (2013.01); H01L 23/295 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/186 (2013.01);
Abstract
A method of manufacturing a semiconductor package structure is provided. A stacked structure formed over the carrier substrate is provided, wherein the stacked structure has a channel with an opening. The stacked structure is immersed into a fluidic molding material to render the fluidic molding material flow into the channel through the openings.