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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10373883 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Oct. 26, 2017

Semiconductor package device and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Yu-An Fang, Kaohsiung, TW;

Chi Sheng Tseng, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 23/053 (2006.01); H01L 23/34 (2006.01); H01L 21/48 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 31/0203 (2014.01); H01L 31/024 (2014.01); H01L 31/02 (2006.01); H01L 23/13 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4803 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/34 (2013.01); H01L 23/49811 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/165 (2013.01); H01L 25/167 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01);
Abstract

A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the first surface of the substrate. The protection layer is disposed on the second surface of the substrate. The protection layer has a first portion adjacent to the first opening and a second portion disposed farther away from the first opening than is the first portion of the protection layer. The first portion of the protection layer has a surface facing away from the second surface of the substrate. The second portion of the protection layer has a surface facing away from the second surface of the substrate. A distance between the surface of the first portion of the protection layer and the second surface of the substrate is greater than a distance between the surface of the second portion of the protection layer and the second surface of the substrate.

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