The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Oct. 02, 2014
Applicant:

Stratasys, Inc., Eden Prairie, MN (US);

Inventors:

Jeffrey Jacob Cernohous, Hudson, WI (US);

Adam R. Pawloski, Lake Elmo, MN (US);

Benjamin A. Demuth, River Falls, MN (US);

Assignee:

STRATASYS, INC., Eden Prairie, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); C08J 5/04 (2006.01); B29C 48/00 (2019.01); B29C 64/106 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2015.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 33/04 (2006.01); B29K 75/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/046 (2013.01); B29C 48/022 (2019.02); B29C 64/106 (2017.08); C08J 5/044 (2013.01); B29K 2023/00 (2013.01); B29K 2025/04 (2013.01); B29K 2033/04 (2013.01); B29K 2075/00 (2013.01); B29K 2995/0082 (2013.01); B29L 2009/00 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08J 2323/08 (2013.01); C08J 2423/12 (2013.01); C08J 2429/04 (2013.01); C08J 2467/04 (2013.01); C08J 2477/06 (2013.01);
Abstract

A consumable assembly for use with an additive manufacturing system to print three-dimensional parts, the consumable assembly including a supply device (e.g., a spool) and a filament supported by the supply device, where the filament has a composition comprising one or more elastomers and one or more reinforcing additives, and a filament geometry configured to be received by a liquefier assembly of the additive manufacturing system. The composition is preferably configured to be thermally and/or chemically modified to reduce its flexural modulus.


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