The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Jan. 07, 2016
Ebara Corporation, Tokyo, JP;
Hisanori Matsuo, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
The present invention relates to a CMP apparatus having a polishing pad surface property measuring device for measuring surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The CMP apparatus includes a polishing pad surface property measuring device () configured to apply a laser beam to a surface of a polishing pad () and to receive reflected light from the polishing pad to obtain reflection intensity in each reflection angle, a processor () configured to perform a Fourier transform on a reflection intensity distribution obtained by the measuring device to obtain a spatial wavelength spectrum of the surface of the polishing pad and to obtain surface properties of the polishing pad by numerical analysis, a dressing control unit () configured to determine dressing conditions of the polishing pad () by a closed loop control based on the surface properties of the polishing pad obtained by the processor, and a dressing apparatus () configured to dress the polishing pad based on the dressing conditions determined by the dressing control unit.