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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10368438 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

Apr. 14, 2017

Printed wiring board and method for manufacturing the same

Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Hiroyuki Nishioka, Ogaki, JP;

Shinsuke Ishikawa, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01); G03F 7/031 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); G03F 7/028 (2006.01); G03F 7/095 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); G03F 7/028 (2013.01); G03F 7/031 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/094 (2013.01); G03F 7/095 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); H05K 1/0313 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 3/0055 (2013.01); H05K 3/282 (2013.01); H05K 3/3452 (2013.01); H05K 3/287 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0269 (2013.01); H05K 2203/0776 (2013.01);
Abstract

A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.

Find Patent Forward Citations

Quick Actions:

Nishioka, Hiroyuki. (2019). Printed wiring board and method for manufacturing the same (U.S. Patent No. 10368438). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10368438

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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