The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Jan. 27, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Hans-Joachim Schulze, Taufkirchen, DE;
Johannes Baumgartl, Riegersdorf, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/36 (2006.01); H01L 21/768 (2006.01); H01L 29/15 (2006.01); H01L 29/165 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/161 (2006.01); H01L 21/02 (2006.01); H01L 29/732 (2006.01);
U.S. Cl.
CPC ...
H01L 29/36 (2013.01); H01L 21/26506 (2013.01); H01L 21/324 (2013.01); H01L 21/76841 (2013.01); H01L 29/0615 (2013.01); H01L 29/155 (2013.01); H01L 29/161 (2013.01); H01L 29/165 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01); H01L 29/7813 (2013.01); H01L 29/861 (2013.01); H01L 29/8611 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 29/732 (2013.01);
Abstract
A semiconductor device includes a semiconductor body having opposite first and second surfaces, a drift or base zone in the semiconductor body and an oxygen diffusion barrier in the semiconductor body. The drift or base zone is located between the first surface and the oxygen diffusion barrier and directly adjoins the oxygen diffusion barrier. The semiconductor device further includes first and second load terminal contacts. At least one of the first and the second load terminal contacts is electrically connected to the semiconductor body through the first surface.