The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
May. 15, 2018
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Wei-Che Chang, Taichung, TW;
Yoshinori Tanaka, Kanagawa, JP;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10891 (2013.01); H01L 21/76224 (2013.01); H01L 27/10823 (2013.01); H01L 27/10876 (2013.01); H01L 29/0649 (2013.01);
Abstract
A semiconductor structure includes a substrate, and first isolation structures, at least one buried word line and at least one second isolation structure which are disposed in the substrate. The buried word line intersects the first isolation structures. The second isolation structure intersects the first isolation structures. A material of at least a portion of the second isolation structure is different from a material of the first isolation structures.