The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Jun. 08, 2017
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chien-Chiang Lin, Tainan, TW;
Chung-Chen Yu, Tainan, TW;
Shih-Chuan Lin, Tainan, TW;
Zhi-Xioung Hu, Tainan, TW;
Chih-Hung Hsueh, Tainan, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01L 21/31111 (2013.01); H01L 21/67057 (2013.01); H01L 21/67086 (2013.01); H01L 21/67253 (2013.01);
Abstract
A method for performing a wet chemical process over a semiconductor wafer is provided. The method includes moving the semiconductor wafer into a chemical solution. The method further includes detecting the concentration of at least one substance in the chemical solution at a plurality of preset time points. The method also includes removing the semiconductor wafer from the chemical solution, when the concentration of the substance is maintained at a fixed approximate value.