The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Jul. 17, 2018
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Tetsukazu Sugiya, Tokyo, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/304 (2013.01);
Abstract
A method of processing a wafer includes a laser beam applying step of applying a laser beam to the wafer to form modified layers in the inside of the wafer along division lines and to extend device layer splitting cracks from the modified layers to the front surface of the wafer. After the laser beam applying step is performed, a cutting step of cutting the wafer is performed by a cutting blade from the back surface side to form cut grooves and to remove the modified layers. Therefore, the modified layers are not left on chips, and the die strength of the chips is enhanced.