The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Sep. 01, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsien-Chang Hsieh, Hsinchu, TW;

Chun-Chih Lin, Taipei, TW;

Tah-te Shih, Hsinchu, TW;

Wen-Hsong Wu, Hsinchu, TW;

Chune-Te Yang, Erlin Township, TW;

Yu-Jen Su, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01N 13/08 (2010.01); H01L 21/67 (2006.01); F27D 17/00 (2006.01); F23J 13/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); F23J 13/02 (2013.01); F27D 17/002 (2013.01); F23J 2900/13001 (2013.01);
Abstract

An exhaust structure includes an intake section including a first high thermal conductivity material, the intake section having an inlet, an output section including a second high thermal conductivity material, the output section having an outlet, and a piping section including a third high thermal conductivity material, the piping section being configured to communicatively couple the intake section with the output section. The exhaust structure provides a high thermal conductivity path from the inlet to the outlet, the high thermal conductivity path including the first high thermal conductivity material, the second high thermal conductivity material, and the third high thermal conductivity material.


Find Patent Forward Citations

Loading…