The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Oct. 04, 2016
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

John Bultitude, Simpsonville, SC (US);

John E. McConnell, Simpsonville, SC (US);

Galen W. Miller, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01); B23K 1/008 (2006.01); B23K 1/20 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); H01G 4/38 (2006.01); H01G 4/232 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/0053 (2013.01); B23K 1/203 (2013.01); B23K 35/0227 (2013.01); B23K 35/3613 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/38 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01G 4/0085 (2013.01); H01G 4/12 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/435 (2015.01);
Abstract

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.


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