The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Jul. 18, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Henry C. Bosak, Hillsboro, OR (US);

Anthony K. Wong, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); H05K 7/20 (2006.01); F28D 15/04 (2006.01); F28D 15/02 (2006.01); B23P 6/00 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); F28D 15/0275 (2013.01); H05K 7/20809 (2013.01); F28D 15/0266 (2013.01); F28D 2015/0216 (2013.01); H05K 7/20663 (2013.01); H05K 7/20672 (2013.01);
Abstract

Embodiments of the present disclosure describe servers having thermal management features and thermal management systems for servers. These embodiments include heat sinks to be thermally coupled by one or more heat pipes to transfer heat from hotter downstream heat sinks to cooler upstream heat sinks in order to distribute thermal loading across multiple devices. In one embodiment a single heat pipe may be used to thermally couple two heat sinks, whereas in other embodiments a modular heat pipe arrangement may be used. Techniques for thermally coupling modular heat pipes to one another such that vapor sections of adjacent heat pipes overlap are also disclosed. Other embodiments may be described and/or claimed.


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