The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Apr. 02, 2018
Applicant:

Power Integrations, Inc., San Jose, CA (US);

Inventors:

Balu Balakrishnan, Saratoga, CA (US);

David Michael Hugh Matthews, Los Gatos, CA (US);

Assignee:

Power Integrations, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H02M 3/335 (2006.01); H02M 7/00 (2006.01); H01L 23/552 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/58 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H04B 5/00 (2006.01); H02M 7/217 (2006.01);
U.S. Cl.
CPC ...
H02M 3/33507 (2013.01); H01L 23/28 (2013.01); H01L 23/3107 (2013.01); H01L 23/48 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/552 (2013.01); H01L 23/58 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H02M 3/33523 (2013.01); H02M 3/33592 (2013.01); H02M 7/003 (2013.01); H04B 5/0031 (2013.01); H04B 5/0081 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/14253 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); H02M 7/2176 (2013.01); Y02B 70/1475 (2013.01);
Abstract

An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within the encapsulation. The lead frame includes a first conductor having an inner conductive loop disposed substantially within the encapsulation and a second conductor galvanically isolated from the first conductor. The second conductor includes an outer conductive loop disposed substantially within the encapsulation proximate to and magnetically coupled to the inner conductive loop to provide a communication link between the first and second conductors.


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