The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jun. 18, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Isaac Lauer, Yorktown Heights, NY (US);

Jiaxing Liu, New York, NY (US);

Renee T. Mo, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/3065 (2006.01); H01L 29/10 (2006.01); H01L 21/324 (2006.01); H01L 21/306 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7843 (2013.01); H01L 21/0217 (2013.01); H01L 21/0245 (2013.01); H01L 21/02428 (2013.01); H01L 21/02433 (2013.01); H01L 21/02532 (2013.01); H01L 21/02598 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 21/324 (2013.01); H01L 21/845 (2013.01); H01L 29/1033 (2013.01); H01L 29/66568 (2013.01); H01L 29/66818 (2013.01); H05K 999/99 (2013.01);
Abstract

A method of forming a strained channel for a field effect transistor, including forming a sacrificial layer on a substrate, forming a channel layer on the sacrificial layer, forming a stressor layer on the channel layer, wherein the stressor layer applies a stress to the channel layer, forming at least one etching trench by removing at least a portion of the stressor layer, channel layer, and sacrificial layer, wherein the etching trench exposes at least a portion of a sidewall of the sacrificial layer, and separates the stressor layer, channel layer, and sacrificial layer into two or more stressor islands, channel blocks, and sacrificial slabs, and removing the sacrificial slabs to release the channel blocks from the substrate using a selective etch, wherein the channel blocks adhere to the substrate surface.


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