The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Aug. 15, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Mathias Plappert, Drobollach, AT;

Stefan Krivec, Arnoldstein, AT;

Andreas Riegler, Lichtpold, AT;

Karin Schrettlinger, Trebesing, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3215 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/40 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/74 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32155 (2013.01); H01L 21/76886 (2013.01); H01L 23/293 (2013.01); H01L 23/298 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 24/03 (2013.01); H01L 29/0619 (2013.01); H01L 29/401 (2013.01); H01L 29/66325 (2013.01); H01L 29/7393 (2013.01); H01L 29/417 (2013.01); H01L 29/41716 (2013.01); H01L 29/7436 (2013.01);
Abstract

In various embodiments, a method is provided. The method includes forming a metallization layer above at least one first region of a substrate. After forming the metallization layer at least one second region of the substrate is free of the metallization layer. The method further includes forming a barrier layer above the at least one first region of the substrate and above the at least one second region of the substrate. The barrier layer in the at least one first region of the substrate directly adjoins the metallization layer. The method further includes removing the barrier layer in the at least one first region of the substrate by drive-in of the barrier layer into the metallization layer.


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