The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jun. 29, 2018
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Philippe Rodriguez, Le Grand-Lemps, FR;

Seifeddine Zhiou, Gafsa, TN;

Fabrice Nemouchi, Moirans, FR;

Patrice Gergaud, La Buisse, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/283 (2006.01); H01L 29/45 (2006.01); H01L 21/285 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 21/283 (2013.01); H01L 21/28575 (2013.01); H01L 29/401 (2013.01); H01L 29/41725 (2013.01); H01L 29/452 (2013.01);
Abstract

A process for manufacturing an intermetallic contact on the surface of a layer or of a substrate of oriented InGaAs material, the contact includes an Ni—InGaAs intermetallic compound, the intermetallic compound having a hexagonal crystallographic structure that may have: a first texture or a second texture formed at a second nucleation temperature above the first nucleation temperature; the process comprising the following steps: the production of nomograms defining, for a thickness of Ni deposited, the time to completely consume the initial thickness of Ni as a function of the annealing temperature, the annealing temperature being below the nucleation temperature of the second texture; the localized deposition of Ni on the surface of the InGaAs material; an annealing step applying the pair of parameters: time required/annealing temperature, deduced from the nomograms, comprising at least one temperature rise step and at least one temperature hold of the final annealing temperature.


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