The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jun. 30, 2017
Applicant:

Azbil Corporation, Tokyo, JP;

Inventors:

Yuki Seto, Tokyo, JP;

Yoshiyuki Ishikura, Tokyo, JP;

Rina Ogasawara, Tokyo, JP;

Assignee:

Azbil Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 13/02 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0055 (2013.01); G01L 9/0051 (2013.01); G01L 9/0052 (2013.01); G01L 13/025 (2013.01); A61B 2562/0247 (2013.01); G01L 19/147 (2013.01);
Abstract

A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.


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