The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Apr. 29, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Han Kim, Suwon-si, KR;
Sang Yul Ha, Suwon-si, KR;
Sung Han Kim, Suwon-si, KR;
Kyung Ho Lee, Suwon-si, KR;
Seok Hwan Ahn, Suwon-si, KR;
Myung Sam Kang, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4688 (2013.01); H05K 1/0271 (2013.01); H05K 1/053 (2013.01); H05K 1/115 (2013.01); H05K 3/0023 (2013.01); H05K 3/1258 (2013.01);
Abstract
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.