The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Nov. 22, 2017
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Isao Obu, Nagaokakyo, JP;
Yasunari Umemoto, Nagaokakyo, JP;
Shigeru Yoshida, Nagaokakyo, JP;
Masahiro Shibata, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/737 (2006.01); H01L 29/08 (2006.01); H01L 29/12 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/737 (2013.01); H01L 29/0817 (2013.01); H01L 29/0821 (2013.01); H01L 29/12 (2013.01); H01L 29/20 (2013.01); H01L 29/401 (2013.01); H01L 29/41708 (2013.01); H01L 29/66242 (2013.01); H01L 29/66318 (2013.01); H01L 29/7371 (2013.01);
Abstract
An HBT includes a semiconductor substrate having first and second principal surfaces opposite each other; and a collector layer, a base layer, and an emitter layer stacked in this order on the first principal surface side of the semiconductor substrate. The collector layer includes a first semiconductor layer with metal particles dispersed therein, the metal particles each formed by a plurality of metal atoms bonded with each other.