The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Jun. 26, 2017
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Seiji Shimabukuro, Yokkaichi, JP;

Raghuveer S. Makala, Campbell, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 29/78 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H01L 29/66 (2006.01); H01L 23/535 (2006.01); H01L 27/1157 (2017.01); H01L 27/11573 (2017.01); H01L 27/11575 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 23/535 (2013.01); H01L 27/1157 (2013.01); H01L 27/11556 (2013.01); H01L 27/11573 (2013.01); H01L 27/11575 (2013.01); H01L 29/66553 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/7849 (2013.01); H01L 29/7889 (2013.01); H01L 29/7926 (2013.01);
Abstract

An alternating stack of insulating layers and spacer material layers is formed over a substrate. The spacer material layers are formed as, or are subsequently replaced with, electrically conductive layers. A retro-stepped dielectric material portion comprising a compressive-stress-generating dielectric material on stepped surfaces of the alternating stack. Memory stack structures are formed through the first-tier alternating stack. Each of the memory stack structures includes a vertical semiconductor channel and a memory film. A patterned tensile-stress-generating material layer is formed over the retro-stepped dielectric material portion in a region that is laterally spaced outward from an outer periphery of a topmost layer within the alternating stack. The patterned tensile-stress-generating material layer applies a tensile stress to the retro-stepped dielectric material portion and to the alternating stack to compensate for the compressive stress generated by the retro-stepped dielectric material portion.


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