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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10354915 B1

PDFFull Text
Date of Patent:
Jul. 16, 2019

Filed:

Mar. 23, 2016

Adhesion layer forming method, adhesion layer forming system and recording medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tomohisa Hoshino, Nirasaki, JP;

Masato Hamada, Nirasaki, JP;

Takashi Tanaka, Nirasaki, JP;

Yuichiro Inatomi, Nirasaki, JP;

Yusuke Saito, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Kirsten Jolley

Int. Cl.
CPC ...
B05D 3/12 (2006.01); H01L 21/70 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01); C23C 18/18 (2006.01); H01L 21/288 (2006.01); B05D 1/00 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); C23C 18/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76874 (2013.01); C23C 18/1893 (2013.01); H01L 21/288 (2013.01); H01L 21/67051 (2013.01); H01L 21/76843 (2013.01); H01L 21/76873 (2013.01); H01L 21/76898 (2013.01); B05D 1/005 (2013.01); C23C 18/1653 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/50 (2013.01);
Abstract

An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substratewhile rotating the substrate. The substrateis rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate

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Hoshino, Tomohisa. (2019). Adhesion layer forming method, adhesion layer forming system and recording medium (U.S. Patent No. 10354915). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10354915

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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