The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Mar. 30, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzung-Chen Wu, Hsinchu, TW;

Tzu Wei Yu, Hsinchu, TW;

Cheng Yu Wu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/67 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); B25J 11/0095 (2013.01); B25J 15/0014 (2013.01); H01L 21/67017 (2013.01); H01L 21/67742 (2013.01);
Abstract

A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.


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