The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Nov. 05, 2015
Applicant:

Commissariat À L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Yann Bogumilowicz, Grenoble, FR;

Jean-Michel Hartmann, Montbonnot Saint-Martin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 25/16 (2006.01); C30B 25/18 (2006.01); C30B 29/06 (2006.01); C30B 29/08 (2006.01); C30B 29/40 (2006.01); C30B 29/42 (2006.01); C30B 29/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02636 (2013.01); C30B 25/16 (2013.01); C30B 25/183 (2013.01); C30B 29/06 (2013.01); C30B 29/08 (2013.01); C30B 29/40 (2013.01); C30B 29/42 (2013.01); C30B 29/68 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02461 (2013.01); H01L 21/02463 (2013.01); H01L 21/02505 (2013.01); H01L 21/02543 (2013.01); H01L 21/02546 (2013.01);
Abstract

First, second and third series of samples are successively made so as to determine the influence of the deposition parameters on the crystallographic quality of a layer of semiconductor material of III-V type. The parameters studied are successively the deposition pressure, the deposition temperature and the deposited thickness of a sub-layer of semiconductor material of III-V type so as to respectively determine a first deposition pressure, a first deposition temperature at the first deposition pressure, and a first deposited thickness at the first deposition temperature and at the first deposition pressure. The sub-layer of semiconductor material of III-V type is thickened by ways of a second layer of semiconductor material of III-V type deposited under different conditions.


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