The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Sep. 13, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shih-Haur Shen, Sunnyvale, CA (US);

Jianshe Tang, San Jose, CA (US);

Jimin Zhang, San Jose, CA (US);

David Maxwell Gage, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 37/20 (2012.01); B24B 37/22 (2012.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/105 (2013.01); B24B 37/205 (2013.01); B24B 37/22 (2013.01); B24B 49/12 (2013.01);
Abstract

During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top surface of an underlying dielectric layer of the substrate exposed and determine based on the first signal. An initial value of the second signal at the determined clearance time is determined. An offset is added to the initial value to generate a threshold value, and a polishing endpoint is triggered when the second signal crosses the threshold value.


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