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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10347786 B1

PDFFull Text
Date of Patent:
Jul. 09, 2019

Filed:

Jan. 25, 2018

Optical sensor package including a cavity formed in an image sensor die

Applicant:

Stmicroelectronics Pte Ltd, Singapore, SG;

Inventors:

Loic Pierre Louis Renard, Singapore, SG;

Cheng-Lay Ang, Singapore, SG;

Assignee:

STMICROELECTRONICS PTE LTD, Singapore, SG;

Attorney:

Seed Intellectual Property Law Group LLP

Primary Examiner:

Dao H Nguyen

Int. Cl.
CPC ...
H01G 9/20 (2006.01); G01S 17/08 (2006.01); G01S 7/481 (2006.01); H01L 31/12 (2006.01); H01S 5/022 (2006.01); H01S 5/183 (2006.01); H01L 31/042 (2014.01); H01L 31/046 (2014.01); H01L 31/047 (2014.01); H01L 31/173 (2006.01); H01L 31/0203 (2014.01); H01L 31/0236 (2006.01); H01L 31/0475 (2014.01);
U.S. Cl.
CPC ...
H01L 31/173 (2013.01); G01S 7/4813 (2013.01); G01S 17/08 (2013.01); H01G 9/20 (2013.01); H01L 31/0203 (2013.01); H01L 31/02366 (2013.01); H01L 31/042 (2013.01); H01L 31/046 (2014.12); H01L 31/047 (2014.12); H01L 31/0475 (2014.12); H01L 31/125 (2013.01); H01S 5/02252 (2013.01); H01S 5/183 (2013.01); Y02E 10/50 (2013.01);
Abstract

One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

Find Patent Forward Citations

Renard, Loic Pierre Louis. (2019). Optical sensor package including a cavity formed in an image sensor die (U.S. Patent No. 10347786). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10347786

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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