The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Mar. 11, 2014
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Shinya Sasagawa, Kanagawa, JP;

Motomu Kurata, Kanagawa, JP;

Taiga Muraoka, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/786 (2006.01); H01L 29/45 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 29/41733 (2013.01); H01L 29/458 (2013.01); H01L 29/78618 (2013.01); H01L 29/78666 (2013.01); H01L 29/78675 (2013.01); H01L 29/78696 (2013.01); H01L 21/02521 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/02631 (2013.01);
Abstract

A semiconductor device for miniaturization is provided. The semiconductor device includes a semiconductor layer; a first electrode and a second electrode that are on the semiconductor layer and apart from each other over the semiconductor layer; a gate electrode over the semiconductor layer; and a gate insulating layer between the semiconductor layer and the gate electrode. The first and second electrodes comprise first conductive layers and second conductive layers. In a region overlapping with the semiconductor layer, the second conductive layers are positioned between the first conductive layers, and side surfaces of the second conductive layers are in contact with side surfaces of the first conductive layers. The second conductive layers have smaller thicknesses than those of the first conductive layers, and the top surface levels of the second conductive layers are lower than those of the first conductive layers.


Find Patent Forward Citations

Loading…