The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Apr. 19, 2018
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Shingo Ujihara, Hiroshima, JP;

Hiroaki Taketani, Hiroshima, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/108 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/165 (2006.01); H01L 29/16 (2006.01); H01L 23/528 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10814 (2013.01); H01L 21/02532 (2013.01); H01L 21/30604 (2013.01); H01L 23/528 (2013.01); H01L 27/10826 (2013.01); H01L 27/10879 (2013.01); H01L 27/10891 (2013.01); H01L 29/0649 (2013.01); H01L 29/0673 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/16 (2013.01); H01L 29/165 (2013.01); H01L 29/42392 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01);
Abstract

Some embodiments include an integrated assembly having a first semiconductor material configured to comprise a pair of pedestals. The pedestals have upper regions which are separated from one another by a space, and have lower regions which join to one another at a floor region beneath the space. A second semiconductor material is configured as a bridge extending between the pedestals. The bridge is spaced from the floor region by a gap. The bridge has ends adjacent the pedestals, and has a body region between the ends. The body region has an outer periphery. Source/drain regions are within the pedestals, and a channel region is within the bridge. A dielectric material extends around the outer periphery of the body region of the bridge. A conductive material extends around the dielectric material. Some embodiments include methods of forming integrated assemblies.


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