The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Mar. 24, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Myung Jin Yim, Santa Clara, CA (US);

Jay S. Lee, Seoul, KR;

Jong-Min Hong, Seoul, KR;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/96 (2013.01); H01L 2924/14 (2013.01); H01L 2924/18162 (2013.01); Y02E 10/52 (2013.01);
Abstract

Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.


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