The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Mar. 19, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 21/3105 (2006.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 43/02 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/0206 (2013.01); H01L 21/31058 (2013.01); H01L 21/565 (2013.01); H01L 21/67126 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/49541 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 43/02 (2013.01); H01L 23/24 (2013.01); H01L 23/3107 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract
An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.