The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Jan. 15, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 9/00 (2006.01); G01B 11/14 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); G01B 11/14 (2013.01); G03F 7/70633 (2013.01); G03F 7/70775 (2013.01); G03F 9/7003 (2013.01); G03F 9/7007 (2013.01); G03F 9/7015 (2013.01); G03F 9/7088 (2013.01); B65G 2203/0233 (2013.01); B65G 2203/041 (2013.01); B65G 2811/0626 (2013.01);
Abstract
Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the water based on the comparison.