The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Sep. 22, 2017
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

Xiuling Li, Champaign, IL (US);

Jeong Dong Kim, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C23F 1/44 (2006.01); H01L 21/768 (2006.01); C23F 1/12 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); C09K 13/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30621 (2013.01); C09K 13/08 (2013.01); C23F 1/12 (2013.01); C23F 1/44 (2013.01); H01L 21/0254 (2013.01); H01L 21/02381 (2013.01); H01L 21/3065 (2013.01); H01L 21/3085 (2013.01); H01L 21/76864 (2013.01);
Abstract

A method of catalyst-assisted chemical etching with a vapor-phase etchant has been developed. In one approach, a semiconductor substrate including a patterned titanium nitride layer thereon is heated, and an oxidant and an acid are evaporated to form a vapor-phase etchant comprising an oxidant vapor and an acid vapor. The semiconductor substrate and the patterned titanium nitride layer are exposed to the vapor-phase etchant during the heating of the semiconductor substrate. The vapor-phase etchant diffuses through the patterned titanium nitride layer, and titanium nitride-covered regions of the semiconductor substrate are etched. Thus, an etched semiconductor structure is formed.


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