logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10343383 B1

PDFFull Text
Date of Patent:
Jul. 09, 2019

Filed:

Dec. 02, 2014

Thermosetting resin composition and prepreg and laminated board prepared therefrom

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Hui Li, Guangdong, CN;

Kehong Fang, Guangdong, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., Guangdong, CN;

Attorney:

Norton Rose Fulbright US LLP

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 27/20 (2006.01); B32B 27/18 (2006.01); B32B 27/04 (2006.01); B32B 15/092 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); C08J 5/04 (2006.01); C08L 79/04 (2006.01); C08G 73/06 (2006.01); C08G 61/02 (2006.01); C08L 61/14 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B32B 27/38 (2013.01); B32B 27/04 (2013.01); B32B 27/285 (2013.01); B32B 27/302 (2013.01); C08G 59/3218 (2013.01); C08G 61/02 (2013.01); C08G 73/065 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08L 61/14 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); H05K 1/03 (2013.01); H05K 1/0373 (2013.01); B32B 2260/046 (2013.01); B32B 2307/306 (2013.01); B32B 2371/00 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2371/12 (2013.01); C08J 2379/04 (2013.01); C08J 2425/08 (2013.01); C08J 2435/06 (2013.01); C08J 2463/00 (2013.01); C08J 2471/10 (2013.01); C08J 2471/12 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01); H05K 1/024 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

Find Patent Forward Citations

Loading…