The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Aug. 23, 2013
Applicant:

Scivax Corporation, Kanagawa, JP;

Inventors:

Hirosuke Kawaguchi, Tokyo, JP;

Tatsuya Hagino, Kanagawa, JP;

Satoru Tanaka, Tokyo, JP;

Assignee:

SCIVAX CORPORATION, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 43/10 (2006.01); B29D 11/00 (2006.01); B29C 43/12 (2006.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); B29C 43/36 (2006.01); B29C 43/02 (2006.01); B29C 43/32 (2006.01); B29C 51/28 (2006.01);
U.S. Cl.
CPC ...
B29C 43/10 (2013.01); B29C 43/12 (2013.01); B29C 43/36 (2013.01); B29C 59/02 (2013.01); B29D 11/00336 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); B29C 51/28 (2013.01); B29C 2043/025 (2013.01); B29C 2043/3233 (2013.01); B29C 2043/3605 (2013.01); B29C 2043/3647 (2013.01); B29C 2043/3652 (2013.01); B29C 2059/023 (2013.01); B29C 2791/006 (2013.01); B29C 2791/007 (2013.01); B29D 11/00 (2013.01);
Abstract

An imprint device and an imprint method which form mold patterns on both surfaces of a molding target. An imprint device transfers mold patterns on both surfaces of a molding target using flexible first and second dies and includes first and second casings which each apply pressure of first and second pressurizing rooms respectively, to the first and second dies respectively and the molding target, a pressurizer that adjusts the pressures of the pressurizing rooms, first and second moving units that move the first and second dies respectively and the molding target in a direction coming close to or distant from each other, a depressurizer that depressurizes a depressurizing room formed between the first and second casings, and eliminates fluids present between the dies and the molding target, and a pressure adjuster that adjusts pressures to reduce pressure differences between the depressurizing room and the pressurizing rooms.


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