The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Jan. 10, 2018
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Jai-Tai Kuo, Hsinchu, TW;

Min-Hsun Hsieh, Hsinchu, TW;

Lung-Kuan Lai, Hsinchu, TW;

Wei-Kang Cheng, Hsinchu, TW;

Chien-Liang Liu, Hsinchu, TW;

Yih-Hua Renn, Hsinchu, TW;

Shou-Lung Chen, Hsinchu, TW;

Tsun-Kai Ko, Hsinchu, TW;

Chi-Chih Pu, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/46 (2013.01); H01L 2224/18 (2013.01);
Abstract

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.


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