The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Dec. 26, 2016
Applicant:
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Inventors:
Emi Kawashima, Chiba, JP;
Takashi Sekiya, Chiba, JP;
Yuki Tsuruma, Chiba, JP;
Yoshihiro Ueoka, Chiba, JP;
Shigekazu Tomai, Chiba, JP;
Motohiro Takeshima, Chiba, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 29/47 (2006.01); H01L 21/28 (2006.01); H01L 29/868 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/47 (2013.01); H01L 21/28 (2013.01); H01L 29/24 (2013.01); H01L 29/247 (2013.01); H01L 29/868 (2013.01); H01L 29/872 (2013.01); H01L 29/0619 (2013.01); H01L 29/0649 (2013.01); H01L 29/66143 (2013.01);
Abstract
A laminated body comprising a substrate, an ohmic electrode layer, a metal oxide semiconductor layer, a Schottky electrode layer and a buffer electrode layer in this order, wherein a reduction suppressing layer is provided between the Schottky electrode layer and the buffer electrode layer.