The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Mar. 05, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Yongki Min, Phoenix, AZ (US);

Reynaldo A. Olmedo, Phoenix, AZ (US);

William J. Lambert, Chandler, AZ (US);

Kaladhar Radhakrishnan, Chandler, AZ (US);

Leigh E. Wojewoda, Tempe, AZ (US);

Venkat Anil K. Magadala, Fremont, CA (US);

Clive R. Hendricks, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01F 17/00 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01F 17/00 (2013.01); H01F 17/0006 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 24/06 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/143 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19042 (2013.01);
Abstract

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.


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