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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10340248 B1

PDFFull Text
Date of Patent:
Jul. 02, 2019

Filed:

Jul. 07, 2017

Bonding systems

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masataka Matsunaga, Kumamoto, JP;

Takashi Koga, Kumamoto, JP;

Takeshi Tamura, Kumamoto, JP;

Takahiro Masunaga, Kumamoto, JP;

Yuji Mimura, Kumamoto, JP;

Masaru Honda, Kumamoto, JP;

Toshifumi Inamasu, Kumamoto, JP;

Satoshi Nishimura, Kumamoto, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Primary Examiner:

Sonya M Sengupta

Int. Cl.
CPC ...
H01L 21/18 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H05K 13/00 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/187 (2013.01); H01L 21/677 (2013.01); H01L 21/67017 (2013.01); H01L 21/67155 (2013.01); H01L 24/75 (2013.01); H05K 13/0061 (2013.01); H01L 21/67092 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75743 (2013.01); H01L 2224/83031 (2013.01); H01L 2224/83122 (2013.01); H01L 2224/83896 (2013.01); H05K 13/0015 (2013.01); Y10T 29/5317 (2015.01); Y10T 29/53091 (2015.01); Y10T 29/53096 (2015.01); Y10T 29/53187 (2015.01); Y10T 29/53261 (2015.01);
Abstract

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

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