The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Mar. 15, 2018
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Chanon Suwankasab, Pathumthani, TH;
Amornthep Saiyajitara, Bangkok, TH;
Chayathorn Saklang, Bangplee, TH;
Stephen Ryan Hooper, Mesa, AZ (US);
Assignee:
NXP B.V., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); G01P 1/02 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/02 (2006.01); H01L 21/52 (2006.01); G01P 15/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); G01P 1/023 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/02 (2013.01); H01L 23/3121 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); G01P 15/00 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.