The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Jun. 08, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Claudia Sgiarovello, Villach, AT;
Martin Mischitz, Wernberg, AT;
Andrew Wood, St. Jakob im Rosental, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 21/76886 (2013.01); H01L 23/5256 (2013.01); H01L 21/76877 (2013.01); H01L 22/14 (2013.01); H01L 23/5252 (2013.01);
Abstract
A die includes a plurality of dielectric landings and a conductive material distributed across one or more of the plurality of dielectric landings. Each one of the plurality of dielectric landings electrically separates two conductive landings associated with the one of the plurality of dielectric landings. The conductive material establishes an electrical connection between the two conductive landings associated with the one or more of the plurality of dielectric landings.