The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Feb. 12, 2016
Asm Technology Singapore Pte Ltd, Singapore, SG;
Richard Van Lieshout, Batenburg, NL;
Guido Knippels, Schijndel, NL;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A wafer grooving apparatus () for forming an elongate recess () in a semiconductor wafer surface, the apparatus comprising: a wafer table () for receiving and holding a semiconductor wafer; a radiation device () for generating a radiation beam (); a beam directing device () for directing the radiation beam to a top surface () of the wafer so as to create a beam spot () where the radiation beam ablates wafer material on the wafer surface to form a recess; a wafer table displacement drive () for effecting a mutual displacement between the radiation beam and the wafer surface in a radiation beam displacement direction; a recess profile measuring device () arranged at a predetermined distance behind the beam directing device in the radiation beam displacement direction effected by the wafer table displacement drive for measuring a depth profile of the recess that has been formed by the radiation beam.