The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Mar. 06, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Jeremy Nabeth, Austin, TX (US);

Onur N. Demirer, Austin, TX (US);

Ramkumar Karur-Shanmugam, Austin, TX (US);

Choon (George) Hoong Hoo, Singapore, SG;

Christian Sparka, Dresden, DE;

Hoyoung Heo, Gyeonggi-do, KR;

Stuart Sherwin, San Jose, CA (US);

Fatima Anis, Milpitas, CA (US);

Mark D. Smith, San Jose, CA (US);

William Pierson, Austin, TX (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01C 1/06 (2006.01); H01L 21/67 (2006.01); G01B 11/27 (2006.01); G06F 17/50 (2006.01); G01B 11/00 (2006.01); G03F 7/20 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); G01B 11/002 (2013.01); G01B 11/272 (2013.01); G03F 7/70633 (2013.01); G03F 9/7046 (2013.01); G06F 17/5009 (2013.01); G01B 2210/56 (2013.01);
Abstract

A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.


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