The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Dec. 04, 2015
Applicants:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Aledia, Grenoble, FR;

Inventors:

Florian Dupont, Grenoble, FR;

Benoit Amstatt, Grenoble, FR;

Bérangère Hyot, Eybens, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B82Y 10/00 (2011.01); H01L 31/0352 (2006.01); H01L 31/0304 (2006.01); H01L 31/0392 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/06 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 33/18 (2010.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02491 (2013.01); B82Y 10/00 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02516 (2013.01); H01L 21/02603 (2013.01); H01L 31/03044 (2013.01); H01L 31/0392 (2013.01); H01L 31/035227 (2013.01); H01L 31/1852 (2013.01); H01L 31/1856 (2013.01); H01L 33/007 (2013.01); H01L 33/06 (2013.01); H01L 33/12 (2013.01); H01L 33/18 (2013.01); H01L 33/32 (2013.01); H01L 29/0676 (2013.01); Y02E 10/544 (2013.01); Y02P 70/521 (2015.11);
Abstract

The electronic device comprises a substrate (), at least one semiconductor wire element () formed by a nitride of a group III material and an electroconductive layer () interposed between the substrate () and said at least one semiconductor wire element (). Said at least one semiconductor wire element () extends from said electroconductive layer (), and the electroconductive layer () comprises a carbide of zirconium or a carbide of hafnium.


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