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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10337100 B1

PDFFull Text
Date of Patent:
Jul. 02, 2019

Filed:

Mar. 12, 2015

Sputtering target comprising ni—p alloy or ni—pt—p alloy and production method therefor

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Kazumasa Ohashi, Ibaraki, JP;

Kunihiro Oda, Ibaraki, JP;

Assignee:

JX NIPPON MINING & METALS CORPORATION, Tokyo, JP;

Attorney:

Howson & Howson LLP

Primary Examiner:

Kevin E Yoon

Assistant Examiner:

Ryan L Heckman

Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/14 (2006.01); G11B 5/64 (2006.01); B22F 5/00 (2006.01); B22F 3/15 (2006.01); B22F 9/08 (2006.01); H01J 37/34 (2006.01); C22C 19/03 (2006.01); G11B 5/851 (2006.01); B22F 1/00 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 1/0003 (2013.01); B22F 3/15 (2013.01); B22F 5/003 (2013.01); B22F 9/082 (2013.01); C22C 1/0433 (2013.01); C22C 19/03 (2013.01); C23C 14/14 (2013.01); G11B 5/647 (2013.01); G11B 5/851 (2013.01); H01J 37/3426 (2013.01); H01J 37/3429 (2013.01); H01J 37/3491 (2013.01); B22F 2301/15 (2013.01); B22F 2998/10 (2013.01);
Abstract

A method of producing a Ni—P alloy sputtering target, wherein a Ni—P alloy having a P content of 15 to 21 wt % and remainder being Ni and unavoidable impurities is melted and atomized to prepare a Ni—P alloy atomized powder having an average grain size of 100 μm or less, the Ni—P alloy atomized powder is mixed with a pure Ni atomized powder, and the obtained mixed powder is hot pressed. An object of the present invention is to provide a method of producing a Ni—P alloy sputtering target which achieves a small deviation from an intended composition.

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